Efficient management and exploitation of thermal energy is key for many engineering applications. Greater understanding and control of thermal processes, such as thermal energy harvesting, storage and ...

In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D ...

Assistant Professor Yan Wang of the Department of Mechanical Engineering has received a CAREER award to advance research to more fully understand phonon wave behaviors, contribute to strategies to ...

Heat management is becoming crucial to an increasing number of chips, and it’s one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the ...

Mechanical Engineering applies the fields of physics, mathematics, and materials science to the design and realization of mechanical and thermal systems. For over a century mechanical engineers have ...

Thermal runaway can result from various factors, including chemical reactions, battery overcharging, environmental conditions, and operational practices. Exothermic reactions, for example, can ...

Alfred University engineering student Andrew Cisco presents group paper “Experimental Investigation of Nano-Enhanced-PCM-Based Heat Sinks for Passive Thermal Management of Small Satellites” at the ...