Abstract: For dynamic multiobjective optimization problems (DMOPs), it is challenging to track the varying Pareto-optimal front. Most traditional approaches estimate the Pareto-optimal sets in the ...

Abstract: Through-silicon-via (TSV) technology permits devices to be placed in the third dimension. Currently, there is a strong motivation for the semiconductor industry to move to 3-D integration ...

The biopharmaceutical industry is rapidly moving from empirical, trial and error process development toward digitalized and ...

Homebuilding artificial intelligence startup Higharc said today it has raised $95 million in a new round of funding to ...

Artificial intelligence (AI) is profoundly reshaping education worldwide. While AI tools increasingly support students in ...

Against the backdrop of global change—characterized by climate warming, shifting precipitation patterns, and intensified anthropogenic disturbances—the ...

Article Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to ...

Engineers must accurately predict thermal stabilization and calibrate simulation software to achieve consistent quality in ...

One proposed solution is a patient-centered management intervention called a care pathway that needs process mapping to support process improvement. Although the adoption and use of Business Process ...

But AI adoption is not unfolding as a single event; it is unfolding in waves. The first phase of AI adoption, infrastructure AI, is already reshaping the global technology economy. Driven by ...

Difficulty modeling should align with trajectories rather than solely the initial question. Existing methods typically rely on static difficulty estimations, handcrafted confidence heuristics, or ...

The estimated total factors in often-overlooked burdens like unpaid caregiving and family-wide earning potential loss.