Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Deep-sea residual oil has been recognized as a significant environmental hazard due to its poor low-temperature fluidity and complex recovery processes necessitating urgent solutions. A segmented ...

This study aims to comprehensively develop a modeling framework to evaluate the dynamic performance of a photovoltaic/thermal (PV/T) system integrated with a hybrid off-grid microgrid. The ...

The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

As electronic devices become increasingly miniaturized, heat management at the nanoscale emerges as a challenge, especially for devices operating in sub-microns. Traditional heat conduction models ...