IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...

Siemens and Samsung Foundry highlight continued collaboration at Samsung SAFE Forum 2026; Joint focus on advanced-node design enablement across photonics, verification, test, pack ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

The head of the Pentawards says this year's shortlists show that eco-friendly design has become mainstream across different categories. Packaging designers are embracing sustainability as the new ...