Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Every cutting-edge AI accelerator, whether it carries an NVIDIA, AMD, or custom hyperscaler logo, must pass through a step ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Odisha has secured a proposed $3.3 billion semiconductor substrate project involving Intel Corporation and 3D Glass Solutions Inc., marking one of the largest high-technology manufacturing commitments ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

ONTO's AI-driven packaging push, $240M Dragonfly deal and 30%+ revenue growth outlook put it ahead of NVMI in the metrology race.

In May 2026, Applied Materials, Inc. reported second‑quarter 2026 sales of US$7.91 billion and net income of US$2.81 billion, ...

IC exports stood at just 559 billion yuan in 2018 when the US initiated its tech war against China. The surge in exports ...