随着 CPO 热度的提升，CPO 测试设备也逐渐成了二级市场上大家关注的焦点。从晶圆到最终模组，每一个 CPO 产品都需要经历四次关键测试。这个文章，我们分析一下 CPO 测试的产业链。 在传统的光模块生产中，PIC（光子集成电路）通常只需要一次晶圆级测试。

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...

Device interface board must balance flexibility in handling with customization for different optical connectors. Test fixtures should account for DUT socketing challenges, such as warpage, coupling, ...

SAN FRANCISCO, Jan. 20, 2026 /PRNewswire/ -- Quantifi Photonics, a leader in scalable photonic IC testing, today introduced the ELSFP 1000 Series - the first PXI-based solution built on the ELSFP ...

Semiconductor devices continuously experience advancements leading to technology and innovation leaps, such as we see today for applications in AI high-performance computing for data centers, edge AI ...

Taiwan-based testing interface giant Winway Technology, a manufacturer of Co-Packaged Optics (CPO) and Chip-on-Wafer-on-Substrate (CoWoS) testing devices, expects growth across the entire year in 2024 ...

Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics (CPO), according ...